HomeNewsMediaTek Expands Dimensity Lineup with Ultra-Efficient 7400, 7400X, and 6400 Chipsets

MediaTek Expands Dimensity Lineup with Ultra-Efficient 7400, 7400X, and 6400 Chipsets

MediaTek has introduced a trio of ultra-efficient chipsets, expanding its industry-leading Dimensity family with the Dimensity 7400, 7400X, and 6400. These new additions promise to enhance gaming performance, AI-powered camera features, and 5G connectivity, catering to both high-tech and mainstream smartphones. While the Dimensity 9400 and 8400 lead the flagship and premium segments, the Dimensity 7400 and 7400X bring high-end gaming and AI camera capabilities, and the Dimensity 6400 delivers impressive 5G performance at an accessible price point.

The Dimensity 7400 and 7400X are powered by an octa-core CPU, integrating 4X Arm Cortex-A78 cores (up to 2.6GHz) and 4X Arm Cortex-A55 cores (up to 2.0GHz), alongside an Arm Mali-G615 MC2 GPU. Built on TSMC’s advanced 4nm process node, these chipsets boast 14% to 36% lower power consumption than competing solutions, making them ideal for extended gaming sessions and demanding applications.

Equipped with MediaTek Advanced Gaming Technology (MAGT) 3.0, these chipsets optimize game settings in real-time, reduce input lag, and enhance power efficiency for a smoother mobile gaming experience. MediaTek’s NPU 6.0 AI processor offers a 15% performance boost over the Dimensity 7300, ensuring seamless AI-driven enhancements in photography, gaming, and everyday tasks.

AI Camera Upgrades and Advanced Connectivity

The Dimensity 7400 and 7400X come equipped with Imagiq 950 ISP, supporting AI-enhanced photography and Google Ultra HDR for higher dynamic range, richer colors, and sharper contrast. Even in low-light conditions, users can capture detailed, high-quality images that retain their brilliance when shared on social media.

The Dimensity 7400X also offers dual-display flip phone support, giving OEMs greater design flexibility. Meanwhile, the integrated 5G R16 modem with 3CC carrier aggregation (3CC-CA) and MediaTek’s UltraSave 3.0+ technology provides a 20% reduction in power consumption, improving battery life without sacrificing performance. Additionally, tri-band Wi-Fi 6E support ensures multi-gigabit wireless speeds with low latency.

Dimensity 6400: Affordable 5G Performance with Efficient Power Consumption

The Dimensity 6400 enhances 5G connectivity for a broader audience, delivering next-gen performance in budget-friendly smartphones. Built on TSMC’s 6nm process node, it features an octa-core CPU with 2X Arm Cortex-A76 cores (up to 2.5GHz) and 6X Arm Cortex-A55 cores (up to 2.0GHz), paired with an Arm Mali-G57 MC2 GPU. The chipset achieves up to 19% lower power consumption during gaming, ensuring longer battery life.

For gaming enthusiasts, MediaTek Bluetooth Wi-Fi HyperCoex Technology reduces latency by 90%, ensuring smoother gameplay. The Release 16 Sub-6 5G Modem with 2CC-CA support delivers 33% faster downlink speeds and 18% faster uplink speeds, significantly enhancing network performance.

In terms of visual capabilities, the Dimensity 6400 supports billion-color displays with 10-bit images and True Color Accuracy, ensuring realistic and vibrant visuals. It also enables 108MP camera sensors, utilizing MediaTek and Arcsoft’s multi-frame noise reduction (MFNR) and low pass noise reduction (LPNR) for sharper selfies and portraits, even in challenging lighting conditions.

Leadership Quote

“With our Dimensity 7400 and Dimensity 6400 chipsets, MediaTek is proving once again that it has the capability to bring incredible smartphone experience to more affordable price ranges,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business. “Whether gaming, using the latest AI applications, or taking photos and videos, users can enjoy the significant performance and impressive energy efficiency that they have come to expect from the Dimensity family.”

Availability and Future Outlook

The first smartphones powered by MediaTek Dimensity 7400 and 7400X are set to launch in Q1 2025, while the Dimensity 6400 is already available. With these new chipsets, MediaTek continues to push the boundaries of mobile performance, ensuring next-level gaming, AI processing, and 5G connectivity for a diverse range of users.

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