In a strategic partnership aimed at advancing 5G connectivity solutions, HFCL Limited, a prominent technology enterprise, has joined forces with MediaTek, a renowned innovator in systems-on-chip (SoC) technology. The collaboration focuses on integrating the class-leading MediaTek T750 chipset into HFCL’s cutting-edge 5G Fixed Wireless Access (FWA) Indoor Customer Premises Equipment (CPE). MediaTek’s reputation for technological innovation aligns seamlessly with HFCL’s commitment to delivering next-generation communications products and solutions.
Cutting-Edge Connectivity Solutions
The HFCL 5G FWA Indoor CPE, powered by MediaTek’s T750 chipset, offers an array of advanced features tailored to meet the demands of modern connectivity. With its ultra-compact form factor and minimal power consumption, the device stands out as a testament to innovative design and engineering. The MediaTek T750 chipset, built on a highly integrated 7nm platform, incorporates a 5G radio and quad-core Arm CPU, ensuring seamless connectivity across multiple devices. Additionally, with dual-band 4×4 Wi-Fi 6 support and a 2.5 Gbps Ethernet interface, users can experience high-speed data transfer like never before.
Versatile Design and User-Friendly Experience
The HFCL 5G FWA Indoor CPE boasts a versatile design that caters to the diverse needs of telecom customers. The device offers unparalleled flexibility and convenience and is equipped with easy mesh capabilities and an embedded eSIM. Its plug-and-play functionality, coupled with an AI-integrated mobile app, enables effortless self-installation and optimal signal location identification. Furthermore, the device’s zero-touch management and automated provisioning features enhance operational efficiency, providing users with a hassle-free experience.
Industry Recognition and Market Prospects
Evan Su, General Manager of Wireless Communications at MediaTek highlighted, “HFCL’s ‘made-in-India’ 5G FWA Indoor CPE powered by the MediaTek T750 chip will help customers experience 5G FWA connectivity globally. This partnership is another milestone in our endeavor to support the Indian government’s vision of creating a sustainable telecom ecosystem by promoting local manufacturing. Our modem propels their vision by offering full functionality, enabling device makers to create high-performance CPE products in the smallest, yet the most efficient form factors.”
Transforming Connectivity Landscape
Mr. Mahendra Nahata, Managing Director of HFCL said, “We are pleased to have partnered with MediaTek, a leading global fabless semiconductor company, and to leverage its state-of-the-art 7nm compact chipset in crafting the revolutionary HFCL 5G FWA Indoor CPE. The HFCL 5G FWA Indoor CPE helps telecom operators address the last-mile connectivity challenges in an ultra-compact form factor and provides a fiber-like experience to both consumers and enterprises. The HFCL 5G FWA Indoor CPE marks another major milestone for HFCL in delivering advanced 5G solutions to telecom operators globally. “
Advantages of the MediaTek T750 Chipset
The MediaTek T750 chipset is a cornerstone of the HFCL 5G FWA Indoor CPE, offering unparalleled performance and versatility. With speeds of up to 4.7Gbps, the integrated 5G modem enables operators to deliver high-speed connectivity rivaling or exceeding fixed-line services. For OEMs and ODMs, the chipset streamlines development processes, reducing time-to-market and development costs. Consumers benefit from a compact, easy-to-install 5G device that allows them to place it anywhere on their properties, revolutionizing the connectivity experience.
The collaboration between HFCL and MediaTek represents a significant milestone in the evolution of 5G connectivity solutions. By leveraging MediaTek’s advanced chipset technology, HFCL is poised to drive innovation and transform the connectivity landscape, delivering unparalleled value to telecom operators and consumers worldwide.
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